Haas SWAK-GEKKO 400 31-plate wafer line for cream filled wafer

HOLLOW WAFER LINE
LOCATION EU - YOM 2013
PERFECT RUNNING CONDITION – LOW WORKING HOURS

Wafer Baking Oven
SWAK-GEKKO 400
Plates: 31
Tong Division: 391
Plate Format: 320 x 480
Installed Power (kW):
Main Drive 1.1
Dough Pump 0.55
Gas Blower 2 x 0.5
Sheet Pickup 0.37
Discharge Device 0.55
Exhaust Gas Fan Gas Consumption (m3/h) 2) 27

• Wafer Cream Spreading Machine
HWSTM-GEKKO
Wafer Sheet Format max. 350 x 500
Capacity (Napolitane/min)
Compressed Air Connection (bar) 6
Compressed Air Consumption (Nml/h) at 6 bar
Dimensions (mm):
Length 3720
Width 1370
Height 1700
Weight (kg): Net 1039
Compressed Air Consumption (Nm3/h) approx. 17.1
Dimensions (incl. Pickup Device) (mm):
Length A 9131
Width B 2270
Height H 2220

Wafer Inverting Machine for placing creamed sheets on top of each other in sandwich
ZLV-GEKKO
Wafer Sheet Format (mm) 320 x 480
Capacity (units/min) 13
Mains Voltage (VCA) 3 x 380 / PE / N Frequency (Hz) 50
Compressed Air Connection (bar) 6
Compressed Air Consumption (Nm3/h) at 6 bar
Dimensions (mm):
Length 2182
Width 1551
Height 1700

Wafer Cooling Tower
KKV-GEKKO HW 120
Trays 106
Dimensions [mm]
Length 2600
Width 1700
Height 4075
Power [kW]
Main Drive 0.18
Infeed Belt 0.37
Discharge Belt 0.37
Compressed Air [bar] 6

Wafer Cutting Machine
AWD-GEKKO
Wafer Sheet Width (mm) 320 x 480
Number of Cut Blocks per Minute max. 7
Compressed Air Connection (bar) 6.0
Drive Systems (kW):
Pressing Unit for Cutting 1 & 2 2 x 1.1
Infeed Belt 0.37
Dimensions (mm):
Length with Infeed Belt 2575
Width 1940
Height 1147